Panel Level Grinder (Izm-68) (Pr289446-2590-P)

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  MT Ref Id - 117278413

  Document Type - Tender Notices

Description - Description: Description: 1 piece: Panel Level GrinderThe production of progressive 2.5 and 3D housing is often based on the exposure of previously hidden (embedded, injected) structures, such as: B. Fine-Pitch-Pillar bumps. Precision processes are e ssential here. A planar structure with the lowest TTV in the range of only a few micrometers is important for the subsequent RDL formation, especially if the finest lines and distances are required at panel level. The system for grinding at the panel level combines thin and simultaneous planarization of a panel and is a major process step for panel level packaging (PLP), especially for fan-out panel level packaging. The grinding of polymer panels

Mt Ref Id - 117278413

Deadline - Oct 07, 2025